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HP-IR3DS-6 Double Layer Infrared Curing Oven Thermal Curing System

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HP-IR3DS-6 Double Layer Infrared Curing Oven Thermal Curing System

Brand Name : Haipai

Model Number : HP-IR3DS-6

Certification : CE,ISO9001

Place of Origin : China

MOQ : 1 unit

Payment Terms : T/T

Delivery Time : 30 working days

Packaging Details : Wooden case with vacuum package inside

Double-Layer Design : 6 temperature zones (3 upper + 3 lower) for twice the curing capacity

6 Heating Tubes per Zone : Uniform heat distribution for consistent curing results

Fast Warm-up : <15 minutes to operating temperature minimizes downtime

Thick Insulation : Minimizes heat loss, reduces energy consumption, and prevents ambient temperature rise

Electric Lid Opening : Software-controlled for easy maintenance access

Large Component Clearance : ±110mm for assembled boards with tall components

SMEMA Interface : Seamless integration with SMT lines

Reinforced High-Temp Guide Rails : Anti-vibration support prevents track shaking and board fall-off

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HP-IR3DS-6 Double-Layer Infrared Curing Oven
The HP-IR3DS-6 Double-Layer Infrared Curing Oven is an advanced thermal curing system engineered for high-volume SMT production environments requiring maximum throughput and precise temperature control.
System Overview
This innovative double-layer design features six independent temperature zones—three upper tracks and three lower tracks—effectively doubling curing capacity compared to single-layer systems while maintaining a compact footprint. The double-layer configuration allows manufacturers to process two separate PCB streams simultaneously, dramatically increasing production throughput without expanding floor space.
Key Features
  • Six independent temperature zones with PID control via touch screen interface
  • Precise thermal profiling from room temperature to 100°C
  • Six heating tubes per zone for uniform heat distribution
  • Double-layer design doubles curing capacity in same footprint
  • Rapid warm-up time under 15 minutes minimizes downtime
  • Energy-efficient design with thick insulation reduces power consumption
  • Durable T1.5 steel plate welded construction
Ideal for thermally-cured conformal coatings, adhesives, and encapsulants in high-volume SMT production environments.
Technical Specifications
Parameter Specification
Model HP-IR3DS-6
External Dimensions (L*W*H) L3000mm * W1080mm * H1300mm
Weight Approx. 580 kg
Control Method PLC + Touch Screen
PCB Transfer Height 910±20mm
Conveyor Speed 0.5-3.5m/min adjustable
Transfer Motor Stepper motor
Conveyor Type Chain conveyor (35B 5mm extended pin stainless steel chain)
PCB Width MAX: 450mm
Rail Width Adjustment Electrically adjustable, 50-450mm
Number of Temperature Zones 6 total (3 upper tracks + 3 lower tracks)
Heating Tubes per Zone 6 pieces
Temperature Control Range Room temperature - 100°C
Warm-up Time <15 minutes
Max PCB Size L450mm * W450mm
Component Clearance ±110mm max
Cover Opening Method Software control, electric lifting
Frame Construction T1.5 steel plate welded
Power Supply AC380V, 50Hz, 3-phase 5-wire
Total Power 19KW
Interface SMEMA

Product Tags:

Double Layer Infrared Curing Ovens

      

Double Layer IR Curing Ovens

      
Quality HP-IR3DS-6 Double Layer Infrared Curing Oven Thermal Curing System for sale

HP-IR3DS-6 Double Layer Infrared Curing Oven Thermal Curing System Images

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